Printed circuit board terminals, block assembly, closed side, THT solder connection, 5.08 mm, Number of poles: 3, Solder pin length (l): 3.5 mm, tinned, orange, Box
Technical Specifications:
| Depth | 13.9 mm |
| Depth (inches) | 0.547 inch |
| Height | 19 mm |
| Height (inches) | 0.748 inch |
| Height of lowest version | 15.5 mm |
| Width | 15.79 mm |
| Width (inches) | 0.622 inch |
| Net weight | 3.84 g |
| RoHS Compliance Status | Compliant without exemption |
| REACH SVHC | No SVHC above 0.1 wt% |
| Category | T1-B |
| Mounting onto the PCB | THT solder connection |
| Number of poles | 3 |
| Number of solder pins per pole | 1 |
| Performance-Category | T1-B |
| Pitch in inches (P) | 0.2 “ |
| Pitch in mm (P) | 5.08 mm |
| Protection degree | IP20 |
| Side termination, characteristic | closed side |
| Solder eyelet hole diameter (D) | 1.3 mm |
| Solder eyelet hole diameter tolerance (D) | + 0,1 mm |
| Solder pin dimensions | 0.95 x 0.8 mm |
| Solder pin length (l) | 3.5 mm |
| Soldering process | Manual soldering Wave soldering |
| Volume resistance | 1.20 mΩ |
| Insulating material | Wemid (PA) |
| Colour | orange |
| Colour chart (similar) | RAL 2000 |
| Insulating material group | I |
| Comparative Tracking Index (CTI) | ≥ 600 |
| UL 94 flammability rating | V-0 |
| Contact base material | Copper alloy |
| Contact material | Copper alloy |
| Contact surface | tinned |
| Coating | 1-3 μm Ni 4-6 μm SN |
| Tinning type | matt |
| Layer structure of solder connection | 1…3 µm Ni / 4…6 µm Sn matt |
| Storage temperature, min. | -40 °C |
| Storage temperature, max. | 70 °C |
| Operating temperature, min. | -50 °C |
| Operating temperature, max. | 120 °C |
| Packaging | Box |
| VPE length | 0 mm |
| VPE width | 0 mm |
| VPE height | 0 mm |
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